Samsung has released details of a new fusion semiconductor that allows manufacturers of consumer electronics devices to produce cheaper, slimmer products with more capabilities.
|
March 28, 2007: Samsung has released details of a new fusion semiconductor that allows manufacturers of consumer electronics devices to produce cheaper, slimmer products with more capabilities.
News of the new silicon chip, which will be used in portable devices like cellphones, digital cameras and MP3 players, was announced at the annual Mobile Solution Forum in Taipei. The new Flex-One NAND chip enables consumer electronics designers to use both types of NAND flash memory – single level cell (SLC) and multi-level cell (MLC) NAND – in the same device for the first time. Previously chip memories were either embedded or external. Product manufacturers who use Flex-One NAND memory chips will be able to adjust their capacity through dedicated software, thereby tailoring the different types of memory to different applications. This provides greater flexibility in how device memories are used and gives designers the flexibility to efficiently modify the memory component within a digital device late in the design cycle.
|
Samsung plans to begin producing the 4GB Flex-OneNAND next month, with other capacities to follow. The company also unveiled gigabyte solid-state disks and 8.4-megapixel CMOS image sensors at the forum.
